⌕ Job Overview:

As an Electrical Packaging Engineer at Salience Labs, you will be responsible for driving the design and delivery of complex electrical packaging solutions for our photonic and electronic modules. This is a critical role in shaping our products as they transition from R&D into high-volume production. You will lead the packaging deliverable, working closely with our optical packaging, hardware, and manufacturing partners to ensure robust, high-yield solutions that meet performance, thermal, and reliability requirements.

This role blends deep technical expertise in electrical packaging with the ability to manage deliverables, coordinate suppliers, and anticipate manufacturing challenges.

You will take a hands-on approach while also owning the strategic planning and execution for packaging activities. The ideal candidate has worked across both design and production environments, understands the nuances of large-scale chip packaging, and is motivated to help define how next-generation optical systems are packaged, tested, and brought to market.

✎ What you'll be doing:

• Lead the definition, design, and execution of electrical packaging solutions for photonic-electronic modules.
• Collaborate with optical packaging, manufacturing and hardware teams to integrate mechanical, thermal, and electrical requirements.
• Specify and oversee interposer designs, substrate layouts, and attachment methodologies.
• Own packaging deliverables from concept to production, including supplier coordination, documentation, and verification.
• Define and execute test plans for thermal performance, mechanical stress, reliability, and compliance.
• Troubleshoot packaging challenges, develop mitigation strategies, and drive yield improvements.
• Work closely with manufacturing partners, both locally and overseas, to ensure manufacturability and cost efficiency.

𓏗𓏗 What we're looking for:

• Strong background in electrical packaging for large-scale semiconductor devices, including substrate and interposer design.
• Experience with high bump-count, large-area chip packaging and associated manufacturing workflows.
• Proven ability to manage packaging deliverables, including supplier engagement and cross-functional coordination.
• Knowledge of mechanical stress, warpage, thermal management, and yield improvement techniques.
• Comfortable working hands-on with prototypes and in a lab environment.
• Excellent communication skills, able to convey technical requirements to internal teams and suppliers.

✧ Even better if you:

• Have experience integrating photonic and electronic packaging in a single module.
• Are familiar with advanced packaging techniques, such as 2.5D interposers, chip-on-substrate, or wafer-level packaging.
• Have worked with suppliers oversees and understand international manufacturing processes.
• Bring experience from both design engineering and production/manufacturing environments.
• Have led packaging projects from concept through to successful product launch.

This is an opportunity to define and deliver the electrical packaging strategy for cutting-edge optical systems. If you want to apply your expertise to a unique technology challenge and play a central role in bringing breakthrough products to market, we would love to hear from you.